Title:
HOLE FILLING INK FOR PREPARATION OF THROUGH-HOLE PRINTED WIRING BOARD AND PREPARATION OF THROUGH-HOLE PRINTED WIRING BOARD
Document Type and Number:
Japanese Patent JP3527809
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To obtain a hole filling ink for the preparation of a through-hole printed wiring board which has a satisfactory curing depth, causes no significant volume shrinkage, has a good grindability, and can be easily removed with an alkali soln. by incorporating a specified monoester compd., a photopolymn. catalyst, a specified rosin, and the like.
SOLUTION: This hole filling ink comprises 1 to 90wt.% monoester compd. (A) represented by formula I and/or II (wherein R1 respresents H or a methyl group, R2 represents H or a 1-4 C alkyl group, Y represents a 1-4 C alkylene group, or group represented by -(CnH2nO)p-CH2- (wherein n is an integer of 2 to 6 and p is an integer of 1 to 19), 0.01 to 20wt.% photopolymn. catalyst (B), and 5 to 40wt.% colorless rosin deriv. (C) having a Hazen color index of not more than 300 and obtd. by hydrogenating a purified rosin and/or colorless rosin deriv. having an acid value of 150 to 500 and a Hazen color index of not more than 300 and obtd. by subjecting an α,β-unsatd. monocarboxylic acid or dicarboxylic acid and a purified resin to an addition reaction and then conducting hydrogenation.
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Inventors:
Doi, Katsuo
Miyayama, Satoshi
Oda, Toshikazu
Miyayama, Satoshi
Oda, Toshikazu
Application Number:
JP13102096A
Publication Date:
May 17, 2004
Filing Date:
April 25, 1996
Export Citation:
Assignee:
GOOU KAGAKU KOGYO KK
International Classes:
C08F20/00; C08F20/26; C08F20/28; C08F32/00; C08F32/04; G03F7/027; C08F290/00; C08F299/02; H05K3/06; H05K3/40; (IPC1-7): H05K3/06; C08F20/00; H05K3/40
Attorney, Agent or Firm:
安藤 惇逸
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