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Title:
HOLLOW POLYAMIDE MOLDING MATERIAL
Document Type and Number:
Japanese Patent JPH07109418
Kind Code:
A
Abstract:

PURPOSE: To obtain a hollow molding material excellent in mechanical strength, rigidity, impact resistance, heat resistance, dimensional stability, and surface smoothness from a more easily available polyamide resin for injection molding.

CONSTITUTION: This hallow molding material comprises 50-96 pts.wt. polyamide resin (composition) having a relative viscosity of 1.8-4.0, 0.5-10 pts.wt. glutarimide copolymer comprising 30-89mol% glutarimide units, 10-69mol% units derived from an α,β-unsaturated ethylenic monomer, and 1-10mol% acid (anhydride) units, and 3-5 pts.wt. whiskers having an average fiber diameter of 0.05-4μm, an average fiber length of 5-500μm, and an aspect ratio of 10 or higher.


Inventors:
TAKARADA AKIRA
TASAKA TAKIO
Application Number:
JP25440693A
Publication Date:
April 25, 1995
Filing Date:
October 12, 1993
Export Citation:
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Assignee:
OTSUKA CHEMICAL CO LTD
International Classes:
B29C49/00; C08K7/02; C08L33/24; C08L77/00; (IPC1-7): C08L77/00; B29C49/00; C08K7/02; C08L33/24
Attorney, Agent or Firm:
Contents Makoto (1 person outside)



 
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