Title:
HOLLOW RESIN PARTICLES FOR SEMICONDUCTOR MEMBER RESIN COMPOSITION
Document Type and Number:
Japanese Patent JP2022096299
Kind Code:
A
Abstract:
To provide styrene-based hollow resin particles for a semiconductor member resin composition that have excellent heat resistance and low water absorption.SOLUTION: According to an embodiment, hollow resin particles for a semiconductor member resin composition include a shell part and a hollow portion that is enclosed by the shell part, and have an ethylenically unsaturated group retention rate of 1%-20%.SELECTED DRAWING: Figure 1
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Inventors:
MATSUURA HARUHIKO
OKAMOTO KOICHIRO
OKAMOTO KOICHIRO
Application Number:
JP2020209333A
Publication Date:
June 29, 2022
Filing Date:
December 17, 2020
Export Citation:
Assignee:
SEKISUI PLASTICS
International Classes:
C08F2/44; C08F2/24; C08F212/08; C08F212/36; C08F255/00; C08F257/02; C08F290/06
Attorney, Agent or Firm:
Takafumi Masui
Masayasu Yoshida
Masayasu Yoshida