Title:
HOLLOW SEALING RESIN SHEET, MANUFACTURING METHOD OF HOLLOW SEALING RESIN SHEET, MANUFACTURING METHOD OF HOLLOW TYPE ELECTRONIC COMPONENT APPARATUS, AND HOLLOW TYPE ELECTRONIC COMPONENT APPARATUS
Document Type and Number:
Japanese Patent JP2013145839
Kind Code:
A
Abstract:
To provide a hollow sealing resin sheet which is excellent in productivity, resin strength, and heat resistance.
A hollow sealing resin sheet is used for hollow-sealing electronic components mounted on an aggregate substrate and is formed by an epoxy resin composition containing the following (A) to (D) components. The hollow sealing resin sheet has multiple cavities 2 (nine cavities in Fig. 1) for housing and hollow-sealing the electronic components on one surface of a sheet body 1. (A) Epoxy resin (B) Hardener (C) Inorganic filler(D) Hardening accelerator
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Inventors:
SHIMIZU YUSAKU
TOYODA HIDESHI
MATSUMURA TAKESHI
TOYODA HIDESHI
MATSUMURA TAKESHI
Application Number:
JP2012006277A
Publication Date:
July 25, 2013
Filing Date:
January 16, 2012
Export Citation:
Assignee:
NITTO DENKO CORP
International Classes:
H01L23/10; H01L23/08
Domestic Patent References:
| JP2011219726A | 2011-11-04 | |||
| JP2010199474A | 2010-09-09 | |||
| JP2010258256A | 2010-11-11 | |||
| JP2010114192A | 2010-05-20 | |||
| JP2011096940A | 2011-05-12 | |||
| JP2000031349A | 2000-01-28 | |||
| JP2005206690A | 2005-08-04 |
Foreign References:
| US20120153513A1 | 2012-06-21 |
Attorney, Agent or Firm:
Masahiko Nishito
Iisaki Aika
Yuko Saito
Iisaki Aika
Yuko Saito