To easily and appropriately remove an electronic component mounted to a board without damaging surrounding circuits thereof.
This hot air blowoff apparatus 100 comprises a pair of movable blower heads 21, 21 having a plurality of blowoff holes 2a for blowing off hot air and provided oppositely, and a rack-and-pinion mechanism 3 for adjusting the space between the pair of the movable heads. The pair of the movable heads are so constructed that the space between them is formed smaller by the rack-and-pinion mechanism to pinch and hold outer side surfaces of an IC 500 mounted to a printed board P by respective outer surfaces of the blowoff holes and to arrange the blowoff holes nearly directly above and opposite to the solder S for fixing the terminal T of the IC.
COPYRIGHT: (C)2008,JPO&INPIT
Yoshio Arafune
Takashi Akazawa
Ryuji Inaba