Title:
低融点ポリプロピレンホモポリマーを基剤とするホットメルト接着剤
Document Type and Number:
Japanese Patent JP6618895
Kind Code:
B2
Abstract:
A hot melt adhesive for use on porous substrates, wherein the hot melt adhesive has about 10% to about 70% by weight of a polypropylene homopolymer having a DSC melting point of less than 100° C.; about 10% to about 60% of a first tackifying resin having a Ring & Ball Softening Point of about 95° C. to about 140° C.; about 0% to about 65% of a second tackifying resin that is different than the first tackifying resin; about 5% to about 50% of a plasticizer; about 1% to about 40% by weight of a secondary polymer which is either a semi crystalline polymer or wax with an enthalpy of fusion of greater than 30 Joules/gram; about 0.1% to about 5% of a stabilizer or antioxidant; wherein the components total 100% by weight of the composition, and the viscosity of the composition is equal to or less than about 20,000 centipoise (cP) at 163° C. (325° F.).
Inventors:
Richard, Haman
La Leopard, Lianne
La Leopard, Lianne
Application Number:
JP2016515063A
Publication Date:
December 11, 2019
Filing Date:
May 21, 2014
Export Citation:
Assignee:
Bostik, Inc.
International Classes:
C09J123/12; C09J5/06; C09J11/06; C09J11/08; C09J123/00
Domestic Patent References:
| JP2013064054A | ||||
| JP2013064055A | ||||
| JP2013064056A | ||||
| JP2003193009A |
Foreign References:
| WO2012068576A1 | ||||
| WO2014154328A1 | ||||
| WO2014130180A1 | ||||
| WO2014105244A1 | ||||
| WO2014058521A1 | ||||
| WO2013134038A1 |
Attorney, Agent or Firm:
Ryoichi Takaoka
Nao Oda
Akiyo Iwahori
Kaoru Takahashi
Nao Oda
Akiyo Iwahori
Kaoru Takahashi