Title:
アイソタクチックポリプロピレンのランダム共重合体に基づくホットメルト接着剤組成物
Document Type and Number:
Japanese Patent JP5093982
Kind Code:
B2
Abstract:
A hot melt adhesive composition is based on an isotactic polypropylene random copolymer (RCP). The composition contains about 4%-50% by weight of the RCP copolymer, about 20%-65% by weight of a compatible tackifier, about 0%-40% by weight of a plasticizer, about 0%-3% by weight of a stabilizer, about 0%-40% by weight of a wax, about 0%-60% by weight of an atactic poly-alpha-olefin (APAO), and about 0%-40% by weight of a secondary polymer. The adhesive composition may be used in a number of applications such as, for example, in disposable nonwoven hygienic articles, paper converting, flexible packaging, wood working, carton and case sealing, labeling and other assembly applications.
Inventors:
One, Baoyu
Kannaski, Monina Daddup
Svenningsen, La Creteia A
Strerow, Diane M
Jean, Cheong Yao
Kannaski, Monina Daddup
Svenningsen, La Creteia A
Strerow, Diane M
Jean, Cheong Yao
Application Number:
JP2004548314A
Publication Date:
December 12, 2012
Filing Date:
September 11, 2003
Export Citation:
Assignee:
Bostik Findlay Incorporated
International Classes:
C09J123/14; B32B27/32; D06M17/00; D06M17/04; C08L23/14
Domestic Patent References:
| JP2006515893A | ||||
| JP2004195955A | ||||
| JP2001288443A | ||||
| JP2006504858A | ||||
| JP2004010809A | ||||
| JP8500369A | ||||
| JP2005505679A | ||||
| JP2004505996A |
Foreign References:
| WO2003091289A1 | ||||
| WO2003087172A1 | ||||
| WO2001046277A1 | ||||
| WO2001053408A1 | ||||
| WO2001096490A1 | ||||
| WO2001018109A1 | ||||
| US5476914 |
Attorney, Agent or Firm:
Shinjiro Ono
Kazuo Shamoto
Tadashi Masui
Yasushi Kobayashi
Akio Chiba
Hiroyuki Tomita
Ken Matsumoto
Kazuo Shamoto
Tadashi Masui
Yasushi Kobayashi
Akio Chiba
Hiroyuki Tomita
Ken Matsumoto