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Title:
HOT-MELT ADHESIVE COMPOSITION FOR BONDING POLYOLEFIN
Document Type and Number:
Japanese Patent JP2001139911
Kind Code:
A
Abstract:

To obtain a new-type hot-melt adhesive composition having high adhesivity to polyolefins as well as high heat-resistance.

The objective adhesive composition contains (1) a polyolefin- based hot-melt adhesive containing a thermoplastic polyolefin or an olefinic thermoplastic elastomer as a base polymer, (2) a polyamide resin and (3) a compatibilizing agent for the above components. The hot-melt adhesive (1) may contain a tackifier and/or a wax. The preferable compatibilizing agent (3) is an acid-modified polyolefin resin.


Inventors:
OKA HITOSHI
SAKAMOTO HIROAKI
Application Number:
JP30887599A
Publication Date:
May 22, 2001
Filing Date:
October 29, 1999
Export Citation:
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Assignee:
THREE M INNOVATIVE PROPERTIES
International Classes:
C09J123/00; C09J177/02; C09J177/06; (IPC1-7): C09J123/00; C09J177/02
Attorney, Agent or Firm:
Takashi Ishida (4 others)