Title:
HOT-MELT ADHESIVE COMPOSITION AND ADHESIVE SHEET
Document Type and Number:
Japanese Patent JP2016188275
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a hot-melt adhesive composition having sufficient adhesive force to a substrate such as an IC card substrate, and capable of maintaining adhesive strength even in a high temperature environment or in a wet heat environment; and to provide an adhesive sheet.SOLUTION: A hot-melt adhesive composition contains: polyamide (a) of having at least either of a carboxy group and an amino group, in which, in the case of having a carboxy group, the acid value is 1 mgKOH/g or higher, and in the case of having an amino group, the amine value is 1 mgKOH/g or higher; polyether-ester amide (b); and epoxide resin (c). An adhesive sheet obtained by forming the hot-melt adhesive composition in a sheet shape is also provided.SELECTED DRAWING: None
Inventors:
KURAHARA TAKU
TOCHIHIRA JUN
TOCHIHIRA JUN
Application Number:
JP2015067910A
Publication Date:
November 04, 2016
Filing Date:
March 30, 2015
Export Citation:
Assignee:
TOMOEGAWA PAPER CO LTD
International Classes:
C09J177/00; B42D25/305; B42D25/47; C09J7/00; C09J163/00
Attorney, Agent or Firm:
Sumio Tanai
Shiro Suzuki
Yuichiro Kawagoe
Shiro Suzuki
Yuichiro Kawagoe