Title:
HOT-MELT ADHESIVE COMPOSITION
Document Type and Number:
Japanese Patent JP2001323232
Kind Code:
A
Abstract:
To obtain a hot-melt adhesive suitable for adhesion of various kinds of plastics in a wide range and metals, comprising a saponified ethylene/vinyl acetate copolymer, a dimer acid polyamide, having improved water resistance at a normal temperature and film-forming properties.
This hot-melt adhesive composition is characterized by comprising (a) 10-50 wt.% of a saponified ethylene/vinyl acetate copolymer having 30-100 wt.% saponification ratio, (b) 10-50 wt.% of a dimer acid polyamide and (c) 10-80 wt.% of an ethylene/methacrylic acid copolymer.
Inventors:
WAKATSUKI CHIKU
MATSUDA EIJI
NAGAHAMA YOSHIO
YAMAMOTO HIROAKI
MATSUDA EIJI
NAGAHAMA YOSHIO
YAMAMOTO HIROAKI
Application Number:
JP2000142590A
Publication Date:
November 22, 2001
Filing Date:
May 16, 2000
Export Citation:
Assignee:
TAOKA CHEMICAL CO LTD
International Classes:
C09J123/08; C09J129/04; C09J133/02; C09J177/06; (IPC1-7): C09J123/08; C09J129/04; C09J133/02; C09J177/06