Title:
HOT MELT ADHESIVE COMPOSITION
Document Type and Number:
Japanese Patent JP2004292716
Kind Code:
A
Abstract:
To obtain a hot melt adhesive composition capable of well adhering polyolefin substrates to each other or a polyolefin substrate to various different materials.
This hot melt adhesive composition comprises a modified polyolefin resin (A). The resin (A) is obtained by graft-modifying a polyolefin resin with an unsaturated carboxylic acid and/or its derivative. The resin (A) contains 0.1-50 wt% of the unsaturated carboxylic acid and/or its derivative and has weight-average molecular weight of 15,000-200,000.
Inventors:
SEKIGUCHI SHUNJI
FUJINO KENICHI
FUJITAKA HISAMASA
NAGAOKA HIDEAKI
FUJINO KENICHI
FUJITAKA HISAMASA
NAGAOKA HIDEAKI
Application Number:
JP2003089635A
Publication Date:
October 21, 2004
Filing Date:
March 28, 2003
Export Citation:
Assignee:
NIPPON PAPER CHEMICALS CO LTD
International Classes:
C09J201/00; C09J151/06; (IPC1-7): C09J201/00; C09J151/06
Attorney, Agent or Firm:
Kiyoshi Minoura
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