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Title:
HOT MELT ADHESIVE COMPOSITION
Document Type and Number:
Japanese Patent JP2005133084
Kind Code:
A
Abstract:

To provide a highly heat resistant hot melt adhesive with low application temperature.

The invention relates to the highly heat resistant hot melt adhesive with low application temperature containing an ethylene n-butyl acrylate copolymer having a melt index (MI) of 750 g/10 min. or higher, an ethylene-vinyl acetate copolymer (EVA) having a melt index (MI) of 750 g/10 min. or higher, a Fischer-Tropsch wax and a modified rosin ester tackifyer having 110°C of softening temperature. The adhesive is especially suitable for sealing of case and carton.


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Inventors:
HANER DALE L
GOOD DAVID J
Application Number:
JP2004293329A
Publication Date:
May 26, 2005
Filing Date:
October 06, 2004
Export Citation:
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Assignee:
NAT STARCH CHEM INVEST
International Classes:
C09J201/00; C09J5/06; C09J123/04; C09J123/08; C09J131/04; C09J133/08; C09J191/06; C09J193/04; C08L23/08; C08L91/06; C08L93/04; (IPC1-7): C09J201/00; C09J123/04; C09J131/04; C09J133/08; C09J191/06; C09J193/04
Domestic Patent References:
JPH11323305A1999-11-26
JP2002003804A2002-01-09
JPH08231935A1996-09-10
JPH1072574A1998-03-17
JPH09503803A1997-04-15
JPH10102019A1998-04-21
JPH11323305A1999-11-26
JP2002003804A2002-01-09
JPH08231935A1996-09-10
Attorney, Agent or Firm:
Atsushi Aoki
Takashi Ishida
Tetsuji Koga
Kenichi Kato
Masaya Nishiyama



 
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