Title:
HOT MELT ADHESIVE COMPOSITION
Document Type and Number:
Japanese Patent JP2017101110
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a hot melt adhesive composition that is excellent in anti-blocking property.SOLUTION: Provided is a hot melt adhesive composition in which in a stringiness test at a nozzle protruding part temperature of 175°C and at a nozzle diameter 1 orifice, the stringing amount is 0 to 0.05 g and the blocking index is 60% or more in an anti-blocking test. In addition, the hot melt adhesive composition comprises a main component of the hot melt adhesive and a coating material covering the surface of this main component, and the main component includes an olefinic resin, a tackifier resin, and a wax, and the coating material is one in which 1 or more of an ethylene vinyl acetate copolymer or a polyethylene wax is mixed with an anionic surfactant whose main hydrophilic group is an anionic type.SELECTED DRAWING: None
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Inventors:
KUWABARA NORIKO
TANIGUCHI TOMOAKI
TANIGUCHI TOMOAKI
Application Number:
JP2015233274A
Publication Date:
June 08, 2017
Filing Date:
November 30, 2015
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD
International Classes:
C09J201/00; C09D7/12; C09D125/14; C09J5/06; C09J11/06; C09J123/00
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