Title:
HOT-MELT ADHESIVE COMPOSITION
Document Type and Number:
Japanese Patent JP3453396
Kind Code:
B2
Abstract:
PURPOSE: To obtain the subject composition containing a base polymer and a specific tackiness-providing resin at a specific ratio, having low molecular weight, excellent in adhesion at high temperature, creep property at high temperature, hue and coating properties and useful as a pressure sensitive agent.
CONSTITUTION: This adhesive composition contains (A) 10-80 pts.wt. base polymer such as PE and (B) 10-80 pts.wt. tackiness-providing resin being a copolymer of (i) a styrene-based monomer of formula I (R1 to R4 are H or 1-4C alkyl) such as styrene and (ii) an indene-based monomer of formula II (R5 to R7 are H or 1-6C alkyl), e.g. indene and having (99/1) to (30/70) molar ratio of the components (i)/(ii) and 300-5000 weight-average molecular weight.
Inventors:
Toshiaki Kuroiwa
Tsuneaki Muro
Takashi Tokita
Beginning of Inagaki
Tsuneaki Muro
Takashi Tokita
Beginning of Inagaki
Application Number:
JP33599892A
Publication Date:
October 06, 2003
Filing Date:
December 16, 1992
Export Citation:
Assignee:
Mitsui Chemicals, Inc.
International Classes:
C08F212/08; C08F32/00; C08F212/00; C08F232/08; C08F234/02; C09J125/00; C09J125/02; C09J125/08; C09J137/00; C09J145/00; C08L53/02; C08L101/00; (IPC1-7): C09J125/08; C09J145/00
Domestic Patent References:
| JP5432542A | ||||
| JP5162834A |
Attorney, Agent or Firm:
Nobuto Watanabe (1 person outside)