Title:
HOT MELT ADHESIVE COMPOSITION
Document Type and Number:
Japanese Patent JP3529552
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To enhance adhesive power and to lessen the deterioration in the adhesive power with lapse of time by incorporating a specific ethylene-α.olefin copolymer, a tacky adhesiveness imparting resin and a softener at respectively specific contents into the compsn.
SOLUTION: This hot melt adhesive compsn. contains 20 to 50wt.% ethylene-α.olefin copolymer of ≤0.9g/cm3 in density, 5 to 70wt.% tacky adhesiveness imparting resin and 5 to 45wt.% softener. Further, the content of the tacky adhesiveness imparting resin is 15 to 50wt.% and the softener contains a process oil. The softener contains paraffin wax of a m.p. of 40 to 70°C. The density of the ethylene-α.olefin copolymer is preferably 0.880 to 9.860g/cm3. This polymer preferably includes the ethylene-α.olefin copolymer copolymerized by using a cyclopentadienyl complex as a catalyst. An α.olefin of 3 to 30C is preferably used as the α.olefin to be copolymerized with ethylene.
Inventors:
Sato, Shinya
Suzuki, Mikio
Suzuki, Mikio
Application Number:
JP15415796A
Publication Date:
May 24, 2004
Filing Date:
June 14, 1996
Export Citation:
Assignee:
KAO CORP
International Classes:
C09J7/00; C09J7/02; C09J123/08; C09J123/16; C09J201/00; G09F3/10; (IPC1-7): G09F3/10
Attorney, Agent or Firm:
羽鳥 修 （外１名）