HOT MELT ADHESIVE COMPOSITION

Japanese Patent JP3778459

B2

PROBLEM TO BE SOLVED: To obtain a polyamide based hot melt adhesive having high bond strength and adheres at relatively low temperature and is capable of film forming.
SOLUTION: The subject composition is produced by mixing (a) 20-60 pts.wt. of polyamide resin, (b) 10-40 pts.wt. of saponification product of a vinyl acetate/ ethylene copolymer of 20-60wt.% vinyl acetate content or the grafted polymer of the saponification product (having the saponification degree of 30-100%), (c) 5-30 pts.wt. of an ethylene/vinyl acetate copolymer containing 20-60wt.% of vinyl acetate, (d) 10-50 pts.wt. of an ethylene-vinyl acetate copolymer containing 5-15wt.% of vinyl acetate and (e) 0.01-5 pts.wt. of a polycarboxylic acid anhydride in amount so that the total of (a), (b), (c), (d) and (e) is 100 pts.wt. This composition is capable of forming a film or a sheet easily and is suitable for bonding metal-to-metal, metal-to synthetic resin and synthetic resin-to-plywood panel and exhibits excellent adhesive strength.

JP5013818	Resin composition and calendar sheet
JPS60147455	POLYETHYLENE COMPOSITION

Eiji Matsuda
Koji Kitano
Koichi Ohashi
Naoya Sano

JP17593496A

May 24, 2006

June 13, 1996

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Taoka Chemical Co., Ltd.
Konishi Co., Ltd.

C08K5/09; C09J123/08; C08L23/08; C08L23/26; C08L29/04; C08L31/04; C08L77/00; C09J5/06; C09J7/00; C09J123/26; C09J129/04; C09J131/04; C09J133/02; C09J135/00; C09J161/06; C09J177/00; C09J193/00; C09J193/04; (IPC1-7): C09J123/26; C08K5/09; C08L23/08; C08L23/26; C08L77/00; C09J5/06; C09J7/00; C09J123/08; C09J129/04; C09J131/04; C09J135/00; C09J161/06; C09J177/00; C09J193/04

JP60168774A
JP61166872A
JP61002778A
JP7505422A
JP60181160A

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