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Patent Searching and Data


Title:
HOT MELT ADHESIVE COMPRISING AROMATIC AMIDE BLOCK COPOLYMER
Document Type and Number:
Japanese Patent JP2006117863
Kind Code:
A
Abstract:

To provide a hot melt adhesive comprising a new aromatic block copolymer, flexible and having excellent cold resistance and adhesiveness with a high softening temperature.

The hot melt adhesive comprises the aromatic amide block copolymer comprising an aromatic amide unit expressed by general formula (1) and a unit selected from a group comprising a polyester, an aliphatic poly(oxyalkylene), a polycarbonate, a polyolefin, a polyorganosiloxane, a polydiene or a copolymer thereof and having 10,000-1,000,000 number average molecular weight based on the standard polystyrene measured by gel permeation chromatography.


Inventors:
SHIMOZATO SHINJI
MORI KATSURO
Application Number:
JP2004309245A
Publication Date:
May 11, 2006
Filing Date:
October 25, 2004
Export Citation:
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Assignee:
TOSOH CORP
International Classes:
C09J177/12; C08G63/685; C09J7/00; C09J109/00; C09J123/00; C09J167/00; C09J169/00; C09J171/00; C09J177/00; C09J183/04