Title:
Hot melt adhesive containing cyanoacrylate curable compound
Document Type and Number:
Japanese Patent JP6363627
Kind Code:
B2
Abstract:
A curable adhesive composition comprising (i) 10 to 80 wt-% of a derivatives of cyanoacrylic esters, cyanopentadienoate esters, methyliden malonate esters (ii) 15 to 50 wt-% non-reactive (co)polymer(s) based on unsaturated monomers selected from vinyl esters or alkyl (meth)acrylates, iii) hydrocarbon resins and optionally iv) additives.
Inventors:
Marx Hehmann
Charles W. Paul
Maria Senidu
Maya Schroeder
Zebastian costilla
Marisa Ferran
Charles W. Paul
Maria Senidu
Maya Schroeder
Zebastian costilla
Marisa Ferran
Application Number:
JP2015558416A
Publication Date:
July 25, 2018
Filing Date:
February 18, 2014
Export Citation:
Assignee:
Henkel AG & Co. KGaA
International Classes:
C09J4/04; C09J5/06; C09J123/04; C09J131/04; C09J133/06
Domestic Patent References:
| JP2012501361A | ||||
| JP11512760A | ||||
| JP11504054A | ||||
| JP62025185A | ||||
| JP11514989A | ||||
| JP10030079A |
Foreign References:
| EP0323720A1 | ||||
| WO2010074095A1 | ||||
| WO2013174776A1 |
Attorney, Agent or Firm:
Mitsuo Tanaka
Hiroshi Yamazaki
Kenichi Morizumi
Hiroshi Yamazaki
Kenichi Morizumi
Previous Patent: A method and a device for changing a flow for peeling off solidification study products
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