To inexpensively obtain a hot melt adhesive film adherable at low temperatures and pressures in an extremely short time and adherable to various objects such as metals and various kinds of plastics including polyolefins as well.

This hot melt adhesive film is obtained from a composition which, in turn, is obtained by incorporating 100 pts.wt. of a total of 100 wt.% of (A) 30-90 wt.% of an epoxy-modified block copolymer prepared by epoxidation of a block copolymer A3 composed of polymer block A1 predominant in vinyl aromatic compound-based monomer unit and polymer block A2 predominant in conjugated diene compound-based monomer unit, (B) 0-60 wt.% of an olefin-based polymer, and (C) 5-40 wt.% of a tackifier such as an aliphatic hydrocarbon, aliphatic saturated hydrocarbon, alicyclic hydrocarbon, alicyclic saturated hydrocarbon, aromatic hydrocarbon, rosin or rosin derivative, terpene or terpene derivative, or coumarone-indene-styrene copolymer, with, as necessary (D) ≤10 pts.wt. of an antioxidant and (E) ≤10 pts.wt. of an antiblocking agent.