To provide a hot-melt adhesive for bonding rubber that does not use any organic solvent and can surely bond rubber to adherends (rubber, plastics, metals and the like) with high bond strength.
In an adhesive comprising the hot-melt adhesive resins, the proportion of functional groups (amino group, carboxy group, epoxy groups or the like) per kilogram of the adhesive is set more than 10 mmol. Such adhesive is selected from hot-melt adhesive polyamide resins and hot-melt adhesive polyester resins and can be comprised of at least one of hot-melt adhesive resins. Further, in order to adjust the concentration of the functional groups, the polymer may include compounds bearing functional groups (for example, a compound bearing an epoxy groups) or compounds having the carbon-carbon double bond or the like.
MATSUI HIDEKI
KAWAHARA TOMOHIRO
| JPH09503018A | 1997-03-25 | |||
| JPH0270724A | 1990-03-09 | |||
| JPS612781A | 1986-01-08 | |||
| JPH08209097A | 1996-08-13 | |||
| JP2000212540A | 2000-08-02 |
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