Title:
HOT-MELT ADHESIVE
Document Type and Number:
Japanese Patent JP2005104996
Kind Code:
A
Abstract:
To provide a hot-melt adhesive which has an excellent adhesiveness both to a polyolefin resin-based adherend and to a cellulosic adherend and exhibits an excellent adhesiveness immediately after bonding and after a long period of storage, irrespective of whether the adherend is dry or wet.
The hot-melt adhesive contains an acid-modified thermoplastic block copolymer, a tackiness-imparting resin, a plasticizing oil and a wax. The hot-melt adhesive contains 50-800 pts.wt. of the tackiness-imparting resin, 5-500 pts.wt. of the plasticizing oil and 1-50 pts.wt. of the wax to 100 pts.wt. of the acid-modified thermoplastic block copolymer.
Inventors:
HONDA JUNICHI
Application Number:
JP2003335901A
Publication Date:
April 21, 2005
Filing Date:
September 26, 2003
Export Citation:
Assignee:
SEKISUI CHEMICAL CO LTD
International Classes:
C09J151/00; C09J153/02; C09J191/00; C09J191/06; (IPC1-7): C09J151/00; C09J153/02; C09J191/00; C09J191/06
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