Title:
HOT-MELT ADHESIVE
Document Type and Number:
Japanese Patent JP3762443
Kind Code:
B2
Abstract:
PURPOSE: To improve copolyamides to be used as hot-melt adhesives for heat sealing.
CONSTITUTION: A hot-melt adhesive is composed only of a copolyamide having a melting point of lower than 140°C to be obtained by copolymerizing at least three types of monomer components selected form lauric acid lactam, 11- aminoundecanoic acid, an equimolar mixture of adipic acid and hexamethylene- diamine, an equimolar mixture of azelaic acid and hexamethylene diamine, an equimolar mixture of sebacic acid and hexamethylene-diamine and an equimolar mixture of dodecanic dicarboxylic acid and hexamethylenediamine and in this copolyamide at least 10 wt.% lauric acid lactam and/or 11- aminoundecanoic acid as the monomer component ratio are copolymerized and said monomer component constitutes 10 wt.% copolyamide component.
Inventors:
Eduard De Young
Carl-Heinz Happert
Carl-Heinz Happert
Application Number:
JP11571294A
Publication Date:
April 05, 2006
Filing Date:
May 27, 1994
Export Citation:
Assignee:
Arkema Gesell Shaft Mitt Beschlenktel Haftung
International Classes:
C09J177/00; C08G69/26; C08G69/36; C09J177/02; C09J177/06; (IPC1-7): C09J177/00
Domestic Patent References:
| JP4522240B1 | ||||
| JP55155077A |
Attorney, Agent or Firm:
Sota Asahina
Fumio Akiyama
Koji Yashima
Fumio Akiyama
Koji Yashima
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