Title:
Hot melt adhesive
Document Type and Number:
Japanese Patent JP6077338
Kind Code:
B2
Inventors:
Yousuke Nakata
Application Number:
JP2013041537A
Publication Date:
February 08, 2017
Filing Date:
March 04, 2013
Export Citation:
Assignee:
SANYO CHEMICAL INDUSTRIES,LTD.
International Classes:
C09J123/26; C09J11/06; C09J151/06
Domestic Patent References:
| JP2005194507A | ||||
| JP5295337A | ||||
| JP56135576A | ||||
| JP2007284574A | ||||
| JP2009057397A | ||||
| JP2004307838A | ||||
| JP8244833A | ||||
| JP8176356A |
Foreign References:
| US20040116569 |