Title:
Hot melt adhesive
Document Type and Number:
Japanese Patent JP6233514
Kind Code:
B2
More Like This:
| JPH03243678 | CURABLE AQUEOUS ADHESIVE COMPOSITION |
| JP2000178524 | ADHERENT POLYMER COMPOSITION |
| JP2004002689 | HOT MELT ADHESIVE |
Inventors:
Noriko Kuwahara
Tetsuya Shimizu
Tetsuya Shimizu
Application Number:
JP2016531127A
Publication Date:
November 22, 2017
Filing Date:
January 26, 2015
Export Citation:
Assignee:
Hitachi Chemical Co., Ltd.
International Classes:
C09J123/08; C09J11/06; C09J11/08; C09J131/04
Domestic Patent References:
| JP3047887A | ||||
| JP2006117829A | ||||
| JP56067209A | ||||
| JP2005036067A |
Foreign References:
| US6716527 |
Attorney, Agent or Firm:
Yoshiki Hasegawa
Yoshinori Shimizu
Hiroyuki Hirano
Hideki Okita
Yoshinori Shimizu
Hiroyuki Hirano
Hideki Okita