Title:
HOT-MELT ADHESIVE
Document Type and Number:
Japanese Patent JPH06336580
Kind Code:
A
Abstract:
PURPOSE: To obtain a hot-melt adhesive which strongly bonds to plastics, fluororesins, and metals.
CONSTITUTION: This hot-melt adhesive is prepd. by mixing an ethylene copolymer having an ethylene content of 50% or higher with a copolyamide in a wt. ratio of (95:5) to (5:95).
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Inventors:
ISHII HIROMITSU
HIRATSUKA MOTONORI
HIRATSUKA MOTONORI
Application Number:
JP12738893A
Publication Date:
December 06, 1994
Filing Date:
May 28, 1993
Export Citation:
Assignee:
TORAY INDUSTRIES
International Classes:
B29C61/06; C09J123/02; C09J123/08; C09J123/26; C09J177/00; (IPC1-7): C09J123/08; B29C61/06; C09J123/08; C09J177/00