Title:
HOT-MELT ADHESIVE
Document Type and Number:
Japanese Patent JPS57205468
Kind Code:
A
Abstract:
PURPOSE: To obtain a hot-melt adhesive excellent in the adhesive strength under shear, by incorporating as main constituents a thermoplastic high molecular compound and a specified modified resin.
CONSTITUTION: A mixture containing 100pts.wt. rosin (e.g. tall oil rosin, gum rosin, or methylol compounds thereof), 3W7pts.wt. calcium hydroxide and up to 3pts.wt. zinc oxide and, if desired, 0.5W10pts.wt. polyhydric alcohol (e.g.ethylene glycol) is heated to react them to obtai a resin (modified rosin) having a softening point of 100W140°C, and the modified rosin is mixed with a thermoplastic high molecular compound (e.g.ethylene/vinyl acetate copolymer or paraffin wax) to obtain a hot-melt adhesive.
Inventors:
YAMANE KOUJI
SANADA YASUYOSHI
ISHIGAMI MASAHISA
ARIMOTO KUNIO
NAKAMURA KAZUMI
TAKIGAWA MASAO
SANADA YASUYOSHI
ISHIGAMI MASAHISA
ARIMOTO KUNIO
NAKAMURA KAZUMI
TAKIGAWA MASAO
Application Number:
JP8854281A
Publication Date:
December 16, 1982
Filing Date:
June 09, 1981
Export Citation:
Assignee:
HARIMA CHEMICALS INC
International Classes:
C08L101/00; C08L7/00; C08L21/00; C08L23/00; C08L77/00; C08L93/00; C08L93/04; C09J193/00; C09J201/00; (IPC1-7): C08L93/04; C08L101/00; C09J3/00
Domestic Patent References:
| JPS4815985A | ||||
| JPS472140A |