PURPOSE: To provide the title adhesive excellent in heat resistance, hot melt bonding workability and bond strength, useful for metals, comprising a specific polyimide and electrically conductive filler at specified proportion.
CONSTITUTION: The objective adhesive comprising (I) a polyimide with ≥80mol% thereof imidated, prepared by reaction between (1) an acid component consisting of (A) a mol of 4,4'-oxydiphthalic dianhydride and (B) b mol of another acid dianhydride (e.g. pyromellitic dianhydride) and (2) an amine component consisting of (C) c mol of 1,3-bis(3-aminophenoxy)benzene and (D) d mol of another diamine component (e.g. 3,3'-dimethyl-4,4'-diaminobiphenyl) with either component A or C being the essential component at the molar ratios: (a+c)/(a+b+c+d)=0.5-1.0 and (a+b)/(c+d)=0.8-1.2 and (II) 50-900wt.%, based on the polyimide, of an electrically conductive filler ≤50μm in mean particle diameter such as of gold, silver or copper.
TAKEDA TOSHIRO
TAKEDA NAOJI
| JPH02252786A | 1990-10-11 | |||
| JPS61195130A | 1986-08-29 | |||
| JPS61296031A | 1986-12-26 | |||
| JPS60258228A | 1985-12-20 | |||
| JPS58157190A | 1983-09-19 | |||
| JPS5546745U | 1980-03-27 | |||
| JPS5964685A | 1984-04-12 | |||
| JPS6248784A | 1987-03-03 |