Title:
HOT-MELT COMPOSITION FOR MOLDING
Document Type and Number:
Japanese Patent JPH04292647
Kind Code:
A
Abstract:
PURPOSE:To provide a hot-melt composition capable of readily integrally being molded and demolded with an adherend without requiring the preliminary treatment with an adhesive and a primer, and giving a molding material layer having rubbery elasticity after molded. CONSTITUTION:A hot-melt composition comprises (A) one or more copolymers selected from hydrogenated styrene-butadiene copolymer, hydrogenated styrene- isobutylene copolymer and a modified product produced by introducing polar groups such as COOH or OH at the parts of the copolymers, (B) the modified product of ethylene-vinyl acetate copolymer, preferably a compound of the formula (X groups are selected from H, alkyl, COOH and carboxylic acid ester group, but the X groups necessarily contain the COOH), and (C) one or more compounds selected from an adhesive agent (e.g. rosin, terpene resin), a wax (e.g. paraffin wax) and a hydrocarbon plasticizer (e.g. liquid paraffin), the component A being 10-70wt.% based on the sum of the component A and B, and the component C being 20-75wt.% based on the sum of the compounds A, B and C.
Inventors:
HIBI KENICHI
OTSUKA SHOZO
OTSUKA SHOZO
Application Number:
JP5914991A
Publication Date:
October 16, 1992
Filing Date:
March 22, 1991
Export Citation:
Assignee:
YOKOHAMA RUBBER CO LTD
International Classes:
C08L23/26; C08L23/00; C08L25/10; C08L29/04; C08L31/04; C08L91/00; C08L91/06; C08L93/00; C09J125/00; C09J125/10; (IPC1-7): C08L23/26; C08L25/10; C08L31/04; C08L91/06; C08L93/00; C09J125/10
Attorney, Agent or Firm:
Nobuto Watanabe (1 person outside)