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Title:
HOT-MELT COMPOSITION
Document Type and Number:
Japanese Patent JPH10130436
Kind Code:
A
Abstract:

To obtain a hot-melt compsn. greatly improved in heat resistance of adhesion and having good low-temp. adhesiveness and workablity by combining an ethylene-vinyl acetate copolymer with another ethylene-vinyl acetate copolymer different in melt index and vinyl acetate content from the former copolymer.

The first ethylene-vinyl acetate copolymer(EVA) has a melt index(MI) of 10-5,000g/10min and a vinyl acetate content(VA) of 5-40wt.%. The second EVA has a MI of 10-800g/10min, a VA of 21-50wt.% a ratio (Mw/Mn) of wt. average mol.wt. (Mw) to number average mol.wt. (Mn) of 2.0-4.0, a content of low-mol.-wt. components (in terms of polystyrene, 15,000 or lower) of 24wt.% or lower, and an m.p.(MP) satisfying the relation: MP≥120-4.1[log(MI)]-1.33VA. The compounding ratio of the first copolymer to the second is (5:95)-(60:40).


Inventors:
WATANABE ICHIGEN
Application Number:
JP30355496A
Publication Date:
May 19, 1998
Filing Date:
October 30, 1996
Export Citation:
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Assignee:
NIPPON UNICAR CO LTD
International Classes:
C08L23/08; C08F2/38; C08L91/06; C08L93/04; C09J123/08; C09J191/06; C09J193/04; (IPC1-7): C08L23/08; C08F2/38; C08L91/06
Attorney, Agent or Firm:
Nobuo Ono