Title:
HOT MELT JOINT COMPOUND
Document Type and Number:
Japanese Patent JPH0525460
Kind Code:
A
Abstract:
PURPOSE: To form a joint excellent in antimildew properties, labor reduction and staining resistance.
CONSTITUTION: The objective hot melt joint compound to be used as a resinous joint compound for filling a joint on a panel or between panels comprising 99.9-10wt.% total of a base polymer selected from among a crystalline polypropylene, a styrene block copolymer, a high-hardness EEA, a high-hardness EVA, etc., a carboxylated tackifying resin and a wax and 0.1-90wt.% extender pigment.
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Inventors:
KITAMURA TADASHI
DOI KIYOTO
YASHIRO KENICHI
DOI KIYOTO
YASHIRO KENICHI
Application Number:
JP18115591A
Publication Date:
February 02, 1993
Filing Date:
July 22, 1991
Export Citation:
Assignee:
MITSUI TOATSU CHEMICALS
International Classes:
C09K3/10; C09D123/08; C09D123/10; C09J153/00; C09J191/06; C09J193/00; E04F13/08; (IPC1-7): C09D123/08; C09D123/10; C09J153/00; C09J191/06; C09K3/10; E04F13/08
Next Patent: FRICTIONAL MATERIAL