Title:
HOT-MELT POLYAMIDE ADHESIVE AND POLYAMIDE RESIN SHEET- SHAPED MOLDED PRODUCT
Document Type and Number:
Japanese Patent JP2002212535
Kind Code:
A
Abstract:
To provide a tenacious hot-melt polyamide adhesive applicable in low-temperature coating and having high heatproof adhesivity, and a polyamide resin sheet-shaped molded product using the hot-melt polyamide adhesive.
The hot-melt polyamide adhesive consists of a polyamide resin having a melt viscosity of 2,000-6,000 mPa.s, and a softening point of ≥80°C and <150°C at 160°C, and an elongation of ≥300% at 23°C. The adhesive can be coated on a base material at a temperature of 150-170°C and has excellent adhesive strength.
Inventors:
MATSUBA YORISHIGE
TERADA NOBUHITO
OSAKO TAKEHISA
MORIMOTO TAKASHI
MAEDA ICHIRO
TERADA NOBUHITO
OSAKO TAKEHISA
MORIMOTO TAKASHI
MAEDA ICHIRO
Application Number:
JP2001013238A
Publication Date:
July 31, 2002
Filing Date:
January 22, 2001
Export Citation:
Assignee:
HARIMA CHEMICALS INC
NITTA GELATIN KK
NITTA GELATIN KK
International Classes:
C08G69/34; C09J5/06; C09J177/00; C09J177/06; (IPC1-7): C09J177/00; C08G69/34; C09J5/06; C09J177/06
Attorney, Agent or Firm:
Nobuyuki Kaneda (2 others)