To overcome the lack of toughness in the adhesive property caused by the large difference between the yield value and the lower yield value appearing after the yield value, which is a severe disadvantage of a polyamide resin showing an extension, by providing an adhesive possessing a toughness in its adhesion property.

The hot-melt polyamide adhesive is prepared by mixing from 20 to 98 pts.wt. bonded product which comprises an acid component comprising a polymerizable fatty acid and one or more dicarboxylic acid and one or more diamine, with from 2 to 80 pts.wt. adhesion-imparting agent having a skeleton with one or more hydroxyl group substitution. Here, the difference between the yield value and the lower yield value of the resin is ≥5 kgf/cm2, and the yield value is from 25 to 45 kgf/cm2.