HOT STAMPING APPARATUS - SANKYO SEIKI SEISAKUSHO KK

Title:

HOT STAMPING APPARATUS

Document Type and Number:

Japanese Patent JP2004131110

Kind Code:

A

Abstract:

To facilitate exchanging work of a stamp head.

This hot stamping apparatus 1 is constituted in such a way that a hot stamp foil and an added value medium are placed between a support stand 4 and the stamp head 3 heated by a heater 2, and they are transferred while a pressure is applied. In addition, a memory 30 is carried on the stamp head 3, and data related to pressure control of the stamp head 3 and data related to temperature control thereof are stored in the memory 30.

More Like This:

JP2001122234	LABEL ADHERING DEVICE
JP4284193	A device for attaching a radio frequency identification tag to an object, and the method thereof.

Inventors:

YOKOZAWA MITSUO
IIZAWA MOTOHIRO
KUROIWA YUKIO
TAKAZAWA KIYOTSUGU

Application Number:

JP2002295745A

Publication Date:

April 30, 2004

Filing Date:

October 09, 2002

Export Citation:

Click for automatic bibliography generation Help

Assignee:

SANKYO SEIKI SEISAKUSHO KK

International Classes:

B65C9/40; (IPC1-7): B65C9/40

Attorney, Agent or Firm:

Kazumi Murase
Keiichi Iguchi

Previous Patent: BAG-AND-COVER

Next Patent: SMALL BAG FOR SEASONING, AND METHOD FOR MANUFACTURING THE SAME