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Title:
電子コンポーネントを収容するためのハウジング、および電子コンポーネント構造
Document Type and Number:
Japanese Patent JP2009542015
Kind Code:
A
Abstract:
A housing can accommodate an electronic component. An outer wall of the housing forms a flat contact wall in which contact areas for connecting the housing to an interconnect device are arranged.

Inventors:
Gunther
Frey, Jürgen
Bashke, Herbert
Application Number:
JP2009516875A
Publication Date:
November 26, 2009
Filing Date:
June 12, 2007
Export Citation:
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Assignee:
EPCOS AG
International Classes:
H01F27/02; H01F17/04
Domestic Patent References:
JPH0799131A1995-04-11
JPS6350482A1988-03-03
JPH0258310U1990-04-26
Foreign References:
US20040051618A12004-03-18
Attorney, Agent or Firm:
Kuro Fukami
Toshio Morita
Yoshihei Nakamura
Yutaka Horii
Hisato Noda
Masayuki Sakai
Nobuo Arakawa



 
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