Title:
How to carry out electroplating of the photoresist demarcation feature from electrolytic copper Plating bath containing the reaction product of imidazole and screw epoxidizing Compound
Document Type and Number:
Japanese Patent JP6275212
Kind Code:
B2
Abstract:
Electroplating methods enable the plating of photoresist defined features which have substantially uniform morphology. The electroplating methods include copper electroplating baths with reaction products of imidazole and bisepoxides to electroplate the photoresist defined features. Such features include pillars, bond pads and line space features.
Inventors:
Matthew Sources
Zula Nyajin Betowa
E Chin
Julia Wartinck
Joanna Dizzy Withek
Eric Redington
Mark Lefebvre
Zula Nyajin Betowa
E Chin
Julia Wartinck
Joanna Dizzy Withek
Eric Redington
Mark Lefebvre
Application Number:
JP2016150475A
Publication Date:
February 07, 2018
Filing Date:
July 29, 2016
Export Citation:
Assignee:
Rohm and Haas Electronic Materials LLC
International Classes:
C25D3/38
Domestic Patent References:
| JP2013527325A |
Foreign References:
| US20120043654 |
Other References:
Hou-Jun Hsu, et al.,A Novel High Coplanarity Lead Free Copper Pillar Bump Fabrication Process,Proceedings of the 2009 IEEE International Interconnect Technology Conference,2009年 6月,169-170
Attorney, Agent or Firm:
Patent Business Corporation Sender International Patent Office