Title:
How to cover the surface of the substrate which consists of a nonmetallic substance using a copper layer
Document Type and Number:
Japanese Patent JP5947284
Kind Code:
B2
Abstract:
The present invention relates to a process for coating a surface of a substrate made of nonmetallic material with a metal layer consisting of providing a substrate made of nonmetallic material; subjecting a surface of said substrate to a treatment for increasing the specific surface area thereof; subjecting the resulting surface to an oxidizing treatment; contacting the resulting substrate with a solution containing an ion of a metal from groups IB and VIII of the Periodic Table; obtaining a substrate comprising ions of a metal that are chemically attached to the nonmetallic material constituting the substrate on at least one of its surfaces; subjecting the ions to a reducing treatment to obtain a substrate comprising atoms of a metal that are chemically attached to the nonmetallic material constituting the substrate on a part of at least one of its surfaces; and contacting the resulting surface with a solution containing ions of a metal.
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Inventors:
Roussel, Sebastian
Gilbert, Frida
Gilbert, Frida
Application Number:
JP2013505589A
Publication Date:
July 06, 2016
Filing Date:
April 19, 2011
Export Citation:
Assignee:
PEGASTECH
International Classes:
C23C18/22; C23C18/16; C23C18/32; C23C18/38; C23C18/42
Domestic Patent References:
| JP2002309375A | ||||
| JP2001026880A | ||||
| JP2003041375A | ||||
| JP7015114A | ||||
| JP63004075A |
Attorney, Agent or Firm:
Iseki Katsumori
Tanaka rice
Tanaka rice