Title:
地盤の削孔方法
Document Type and Number:
Japanese Patent JP6631953
Kind Code:
B2
Inventors:
Katsuhito
Shunsuke Shinagawa
Shunsuke Shinagawa
Application Number:
JP2016058329A
Publication Date:
January 15, 2020
Filing Date:
March 23, 2016
Export Citation:
Assignee:
Civil Engineering Research Institute
International Classes:
E02D1/04
Domestic Patent References:
| JP6322765A | ||||
| JP5156623A | ||||
| JP52058207A | ||||
| JP9264015A |
Foreign References:
| US20110094801 |
Attorney, Agent or Firm:
Tetsuya Mori
Suzuki Isobe
Hide Tanaka Tetsu
Ichi Hirose
Toru Miyasaka
Suzuki Isobe
Hide Tanaka Tetsu
Ichi Hirose
Toru Miyasaka