Title:
製造された部品の取り付けおよび位置合わせを評価する方法
Document Type and Number:
Japanese Patent JP2006504958
Kind Code:
A
Abstract:
An automated method is provided for assessing fit and alignment of an assembly component in relation to its assembly environment. The method includes: collecting measurement data for the assembly component; defining model data representative of an assembly environment, where the assembly environment is defined by surfaces of objects that are adjacent to the assembly component in an assembled configuration; and comparing the measurement data with the model data for the assembly environment, thereby assessing the assembly component in relation to its assembly environment.
Inventors:
John H Kid
Chen Qi Lin
Mark Maikituku
Chen Qi Lin
Mark Maikituku
Application Number:
JP2004548658A
Publication Date:
February 09, 2006
Filing Date:
October 31, 2003
Export Citation:
Assignee:
Perceptron Incorporated
International Classes:
G01B21/20; G01B11/25; G06F1/00; G06F19/00; G06K9/00; G06T7/00; G06F
Attorney, Agent or Firm:
Mitsue Obuchi
Yukio Fuse
Inoue Ichi
Yukio Fuse
Inoue Ichi