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Title:
金属基板の表面にチャネルを形成する方法
Document Type and Number:
Japanese Patent JP4731101
Kind Code:
B2
Abstract:
A method for forming a channel (80) within a coated (72, 74), metal-based substrate (54) is described. In one technique, a channel-forming material (50) is first deposited on the substrate (54), followed by the deposition of a bonding agent (58), such as a braze. One or more coatings (72, 74) can then be applied over the substrate (54). In one embodiment, the channel (80) is formed when the channel-forming material (50) is subsequently removed. In another embodiment, the channel (20) is formed due to the lack of adhesion between particular channel-forming materials (10) and the overlying bonding agent (18). Related articles are also described, e.g., gas turbine components which include protective coatings and a pattern of cooling channels.

Inventors:
Wayne Charles Hass
Benkato S. Ben Kataramani
Chin-Pan Lee
Application Number:
JP2003127650A
Publication Date:
July 20, 2011
Filing Date:
May 06, 2003
Export Citation:
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Assignee:
GENERAL ELECTRIC COMPANY
International Classes:
C23C28/00; B23P15/00; B81B1/00; C23C4/00; C23C4/18; C23C26/00; C23C26/02; F01D5/18; F01D5/28; F02C7/00; F02K9/64; F23R3/00
Domestic Patent References:
JP2001179431A
JP2000160318A
JP4111940A
JP61210172A
Foreign References:
US20010001897
Attorney, Agent or Firm:
Arakawa Satoshi
Hirokazu Ogura
Nobukazu Ito



 
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