Title:
How to form a conductive film
Document Type and Number:
Japanese Patent JP6326099
Kind Code:
B2
Abstract:
Provided herein is a device for forming a conductive film. The device includes a deposition device and an air supply. The deposition device is configured to form a wet film having conductive nanostructures and a fluid carrier on a web. The web is moved in a first direction while forming the wet film. The air supply is disposed at a side of the web and configured to apply an air flow onto the wet film. The air flow is directed onto the wet film in a second direction perpendicular to the first direction to reorient a direction of some conductive nanostructures in the wet film to define reoriented conductive nanostructures.
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Inventors:
Florian Chenitska
Jonathan Westwater
Jonathan Westwater
Application Number:
JP2016159535A
Publication Date:
May 16, 2018
Filing Date:
August 16, 2016
Export Citation:
Assignee:
CM Holding Corporation
International Classes:
B05D5/12; B05D3/04; B05D7/00; B05D7/24; H01B13/00
Domestic Patent References:
| JP2009009847A | ||||
| JP2005255543A | ||||
| JP2010205873A | ||||
| JP2046799A |
Foreign References:
| US20090052029 |
Attorney, Agent or Firm:
Ken Ieiri