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Patent Searching and Data


Title:
How to form the corner of the letter of a round (METHODFORMINGAROUNDEDCORNER)
Document Type and Number:
Japanese Patent JP6113462
Kind Code:
B2
Abstract:
The present invention relates to a method for forming a rounded corner using a plate material having a predetermined width and a predetermined length. The present invention includes: a step of perforating a perforation section having a pair of parallel sides which are parallel to and spaced from each other with respect to the lengthwise direction of the plate material, a pair of vertical sides the length of which is shorter than the gap between the pair of parallel bars interposed therebetween, and which form right angles with respect to the pair of parallel bars, and two pairs of oblique sides which respectively connect the parallel sides and the vertical sides adjacent to each other with each other at an angle, wherein the perforation section has a through-hole having an octagonal cross-sectional shape in the plate material; a step of bending the plate material inward along a line extending from each of the parallel sides, bending the plate material inward along a virtual line extending between the vertices of the pair of vertical sides adjacent to one of the pair of parallel sides, and bending the plate material inward along a virtual line extending between the other vertices of the pair of vertical sides; and a step of forming the corner by bending the plate material which is bent inward in such a manner that the oblique sides face each other.

Inventors:
La mince
Application Number:
JP2012250435A
Publication Date:
April 12, 2017
Filing Date:
November 14, 2012
Export Citation:
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Assignee:
RAH SEONG INDUSTRIAL CO., LTD.
International Classes:
B21D5/01; B21D11/08
Domestic Patent References:
JP2005297036A
JP63286226A
JP2501814A
Attorney, Agent or Firm:
Maeda/Suzuki International Patent Corporation