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Title:
半導体ディスクレーザ(SDL)を取り付ける方法および装置
Document Type and Number:
Japanese Patent JP6585036
Kind Code:
B2
Abstract:
The present invention describes a method and apparatus for mounting a semiconductor disc laser (SDL). In particular there is described a cooling apparatus assembly (12) for mounting the semiconductor disc laser (1) the cooling apparatus assembly comprising a crystalline heat spreader (8) made of diamond, sapphire or SiC and optically contacted to the SDL (1). The apparatus further comprises a heatsink (13) made of copper and a recess (16) located on a first surface (15) of the heatsink. A pliable filler material (17) which may be In or an In alloy is provided within the recess (16) such that when a sealing plate (19) is fastened to the heatsink the SDL (1) is hermetically sealed within the recess. Hermetically sealing the SDL within the recess is found to significantly increase the lifetime of the device comprising the SDL. The heat sink (13) may be water cooled with pipes (14) delivering the water. In case the sealing plate (19) is made from for example Invar, it has an aperture (20).

Inventors:
Craig James, Hamilton
Maker, Gareth Thomas
Application Number:
JP2016516246A
Publication Date:
October 02, 2019
Filing Date:
May 30, 2014
Export Citation:
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Assignee:
SOLUS TECHNOLOGIES LIMITED
International Classes:
H01S5/024; H01L23/36; H01S5/022
Domestic Patent References:
JP2067782A
JP1179483A
JP59151484A
Foreign References:
WO2005055381A1
Other References:
ANTTI HARKONEN, et al.,“High Power Frequency Doubled GaInNaS Semiconductor Disk Laser Emitting At 615nm”,OPTICS EXPRESS,OPTICAL SOCIETY OF AMERICA,2007年 3月19日,Vol.15 No.6,p.3224-3229
J. Rautiainen, et al.,“1 W at 617nm generation by intracavity frequency conversion in semiconductor disk laser”,ELECTRONICS LETTERS,2007年 8月31日,Vol.43, No.18,p.980-981
Attorney, Agent or Firm:
Patent business corporation Kita Aoyama International