Title:
接着剤を用いてデバイスを相互接続するための方法
Document Type and Number:
Japanese Patent JP4516205
Kind Code:
B2
Abstract:
A method and apparatus for interconnecting at least two devices. Each of the interconnected devices includes a contact structure for electrically and/or physically interconnecting the devices. Preferably, the contact structure for at least one of the devices includes a spring contact. An adhesive, such as a UV-curable adhesive, is applied to at least a portion of one of the devices, and once the adhesive is applied, the devices are assembled, i.e., brought into sufficient proximity so that the contact structures interconnect the devices. The adhesive can be applied directly to contact structures of one of the devices and/or can be applied to other portions of the devices so that the adhesive flows around the contact structures during assembly. The adhesive is then cured to bond the devices together. Applying the adhesive before assembling the devices prevents interference with the interconnection between the contact structures, especially if the contact structures include spring contacts to be electrically connected with corresponding contact pads.
Inventors:
Christopher El Chua
David Kay Folk
Patrick Zee Kim
Linda Romano
David Kay Folk
Patrick Zee Kim
Linda Romano
Application Number:
JP2000372324A
Publication Date:
August 04, 2010
Filing Date:
December 07, 2000
Export Citation:
Assignee:
XEROX CORPORATION
International Classes:
G01R1/06; H01R43/02; H01L21/56; H01L23/32; H01L23/48; H01L23/485; H01L23/52; H01R4/04; H01R12/52; H05K3/32
Domestic Patent References:
| JP11506829A | ||||
| JP6074972A | ||||
| JP11345834A |
Attorney, Agent or Firm:
Kenji Yoshida
Jun Ishida
Jun Ishida