Title:
車両用ガラスにハードウェアを接合する方法
Document Type and Number:
Japanese Patent JP6906448
Kind Code:
B2
Abstract:
Methods of bonding together substrates that do not require use of primers, mixing, fixturing, or autoclaving. These methods can include the steps of disposing an adhesive layer on a bonding surface of either substrate, the adhesive layer comprising a curable composition that is dimensionally stable at ambient conditions; either before or after disposing the adhesive layer on the bonding surface, irradiating the adhesive layer with ultraviolet radiation to initiate curing of the curable composition; placing one substrate so as to be bonded to the other substrate by the adhesive layer; and allowing the adhesive layer to cure.
Inventors:
Anderson, Cyrus A.
Chastec, Thomas Kew.
Gao, Xiao
Schaefer, Kathleen S.
Ye, Shen
Chastec, Thomas Kew.
Gao, Xiao
Schaefer, Kathleen S.
Ye, Shen
Application Number:
JP2017562617A
Publication Date:
July 21, 2021
Filing Date:
June 01, 2016
Export Citation:
Assignee:
3M INNOVATIVE PROPERTIES COMPANY
International Classes:
C09J5/00; C08G59/62; C09J11/06; C09J133/04; C09J163/00; C09J167/00; C09J171/00
Domestic Patent References:
| JP2004530745A | ||||
| JP11502542A | ||||
| JP6507664A | ||||
| JP6306346A |
Foreign References:
| WO2014047932A1 |
Attorney, Agent or Firm:
Yoshiki Hasegawa
Ikeda adult
Yoshinori Shimizu
Junichiro Sakamaki
Ikeda adult
Yoshinori Shimizu
Junichiro Sakamaki