Title:
樹脂製部材の接合方法
Document Type and Number:
Japanese Patent JP5233991
Kind Code:
B2
Abstract:
A method for bonding resin members by laser welding in which melting of a resin member can be prevented on the contact surface with a base or a tool used for bonding. In the bonding method, a resin member (1) is mounted on a base (3) and a surface of the base (3) in contact with the resin member (1) is an optical mirror surface. A surface of the resin member (1) is coated with a light absorbing agent (4), a resin member (2) is placed thereon and then a laser light (10) is irradiated from the resin member (2) side in order to melt the resin on the bonding surface of the resin member (1) and the resin member (2), thereby bonding the resin members together. The laser light (11) penetrated through the bonding surface reaches the contact surface where the resin member (1) and the base (3) are in contact with each other, and since the laser light (11) penetrates the bonding surface without being scattered or absorbed, melting of the resin member can be prevented.
Inventors:
Mikishi Sekihara
Mika Uehira
Mika Uehira
Application Number:
JP2009506302A
Publication Date:
July 10, 2013
Filing Date:
March 19, 2008
Export Citation:
Assignee:
Konica Minolta Advanced Layer Co., Ltd.
International Classes:
B29C65/16; B23K26/32
Domestic Patent References:
| JPS62142092A | 1987-06-25 | |||
| JPH01310934A | 1989-12-15 | |||
| JPH04157082A | 1992-05-29 | |||
| JP2005262531A | 2005-09-29 |
Attorney, Agent or Firm:
Misawa patent office