Title:
アセンブリを製造する方法及びアセンブリ
Document Type and Number:
Japanese Patent JP2009500820
Kind Code:
A
Abstract:
The assembly (100) comprises a laterally limited semiconductor substrate region (15) in which an electrical element (20) is defined. Thereon, an interconnect structure (21) is present. This is provided, at its first side (101) with contact pads (25,26) for coupling to an electric device (30), and at its second side (102) with connections (20) to the electrical element (11). Terminals (52,53) are present at the second side (102) of the interconnect structure (21), and coupled to the interconnect structure (21) through extensions (22,23) that are laterally displaced and isolated from the semiconductor substrate region (15). An electric device (30) is assembled to the first side (101) of the interconnect structure (21), and an encapsulation (40) extending on the first side (101) of the interconnect structure (21) so as to support it and encapsulating the electric device (30) is present.
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Inventors:
Deckle ronald
Destinbel Marc Ay
De Haas Wilhelms H
Michelsen Theodorus M
Schoafs Franciscus ACM
Fan Fern Nicolas Jay A
Destinbel Marc Ay
De Haas Wilhelms H
Michelsen Theodorus M
Schoafs Franciscus ACM
Fan Fern Nicolas Jay A
Application Number:
JP2008519034A
Publication Date:
January 08, 2009
Filing Date:
June 23, 2006
Export Citation:
Assignee:
Koninklijke Philips Electronics N.V.
International Classes:
H01L23/12; H01L21/60; H01L23/29; H01L23/31; H01L25/065; H01L25/07; H01L25/18
Attorney, Agent or Firm:
Susumu Tsugaru
Akihiko Miyazaki
Fueda Shusen
Akihiko Miyazaki
Fueda Shusen