Title:
電気装置において電気的接続を設ける方法
Document Type and Number:
Japanese Patent JP5266235
Kind Code:
B2
Abstract:
Certain examples disclosed herein are directed to materials that are designed for use in interconnects of electrical devices such as, for example, printed circuit boards and solar cells. In certain examples, a two-step solder may be used to reduce stresses on the materials used in the production of the electrical devices.
Inventors:
Margie, Michael Tee
Kep, Paul
De Monti, Mihil Ah
Fink, Martinas N
Lewis, Bryan
Kep, Paul
De Monti, Mihil Ah
Fink, Martinas N
Lewis, Bryan
Application Number:
JP2009533505A
Publication Date:
August 21, 2013
Filing Date:
October 17, 2007
Export Citation:
Assignee:
Frise Metals Incorporated
International Classes:
B23K1/00; B23K1/005; B23K35/26; C22C11/06; C22C12/00; C22C13/00; C22C13/02; C22C28/00; H01L31/042; B23K101/40; B23K101/42
Domestic Patent References:
| JP2006263774A | ||||
| JP8018285A | ||||
| JP5245687A | ||||
| JP11239866A | ||||
| JP2008529281A | ||||
| JP7169908A | ||||
| JP1236636A |
Attorney, Agent or Firm:
Kuro Fukami
Toshio Morita
Yoshihei Nakamura
Yutaka Horii
Masayuki Sakai
Nobuo Arakawa
Masato Sasaki
Toshio Morita
Yoshihei Nakamura
Yutaka Horii
Masayuki Sakai
Nobuo Arakawa
Masato Sasaki