Title:
靴の製造方法
Document Type and Number:
Japanese Patent JP5449663
Kind Code:
B2
Abstract:
The attachment connects the vamp and the outsole of a shoe. The arrangement comprises a vamp 200, comprising a lateral vamp 210 and a bottom vamp 220; a connecting medium apparatus 230, comprising a first wall 231 enclosing the lateral vamp, a second wall 232 connected to the first wall and extending outward, a third wall 233 connected to the second wall and extending downward, and a forth wall 234 connected to said third wall and extending inward, wherein the second wall 232 comprises a plurality of holes 235; and an outsole 240 enclosing the connecting medium apparatus and the bottom vamp 220, wherein a material forming the outsole fills a gap between the forth wall 234 of the connecting medium apparatus and the bottom vamp and the holes in the second wall.
Inventors:
Chen Chung
Application Number:
JP2007274800A
Publication Date:
March 19, 2014
Filing Date:
October 23, 2007
Export Citation:
Assignee:
Inscription virtue
International Classes:
B29C43/18; A43B13/16; B29C43/34; B29D35/00; B29D35/06; B29L31/50
Domestic Patent References:
| JP50011740U | ||||
| JP57188202A | ||||
| JP2008518698A | ||||
| JP2004267779A |
Foreign References:
| WO2006048024A1 |
Attorney, Agent or Firm:
Masaki Hattori