Title:
中間フレームアセンブリ、電子装置、および中間フレームアセンブリの製造方法
Document Type and Number:
Japanese Patent JP6972335
Kind Code:
B2
Abstract:
A middle frame assembly (30) may include a middle frame (20) and a bearing plate (40). The middle frame (20) may include a first and second surfaces (202, 204) opposite to each other and defining a first and second through holes (20a, 20b) spaced apart from each other, and both the first and second through holes (20a, 20b)may penetrate the first and second surfaces (202, 204). The bearing plate (40) may include a bearing body (42) having a third surface (422), a first extending portion (44) extending from the third surface (422), configured to pass through the first through hole (20a) and have an interference fit with the middle frame (20), and a second extending portion (46) extending from the third surface (422), spaced apart from the first extending portion (44), configured to pass through the second through hole (20b) and have a clearance fit with the middle frame (20).
Inventors:
Juan, Huion
Application Number:
JP2020524351A
Publication Date:
November 24, 2021
Filing Date:
November 20, 2018
Export Citation:
Assignee:
GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORP., LTD.
International Classes:
F16B5/07; F16B4/00; F16B5/08; F16B11/00; G06F1/16
Domestic Patent References:
| JP2009068554A | ||||
| JP2010084929A | ||||
| JP5202914A |
Foreign References:
| CN205071068U | ||||
| CN205490743U |
Attorney, Agent or Firm:
Yukitaka Nakamura
Satoru Asakura
Takeshi Sekine
Masashi Yoshida
Tomoya Deguchi
Satoru Asakura
Takeshi Sekine
Masashi Yoshida
Tomoya Deguchi