Title:
マイクロマシンの構成要素の製造方法
Document Type and Number:
Japanese Patent JP4603641
Kind Code:
B2
Abstract:
A method for fabricating a micromechanical component, in particular a surface-micromechanical acceleration sensor, involves preparing a substrate and providing an insulation layer on the substrate, in which a patterned circuit trace layer is buried. A conductive layer, including a first region and a second region, is provided on the insulation layer, and a movable element is configured in the first region by forming a first plurality of trenches and by using an etching agent to remove at least one portion of the insulation layer from underneath the conductive layer. A contact element is formed and electrically connected to the circuit trace layer in the second region by configuring a second plurality of trenches, and the resultant movable element is encapsulated in the first region. The second plurality of trenches for forming the contact element in the second region is first formed after the encapsulation of the movable element formed in the first region.
Inventors:
Helmut Scapa
Horst munzel
Franz Realmer
Michael Offenberg
Heinz-Georg Fossenberg
Horst munzel
Franz Realmer
Michael Offenberg
Heinz-Georg Fossenberg
Application Number:
JP12050599A
Publication Date:
December 22, 2010
Filing Date:
April 27, 1999
Export Citation:
Assignee:
ROBERT BOSCH GMBH
International Classes:
G01P15/125; H01L29/84; B62D57/00; B81B3/00; B81B7/00; B81C1/00; B81C3/00; G01P1/02; G01P15/08
Domestic Patent References:
| JP9129898A | ||||
| JP9129896A |
Attorney, Agent or Firm:
Toshio Yano
Hiroshi Sugimoto
Toshiomi Yamazaki
Takuya Kuno
Reinhard Einsel
Hiroshi Sugimoto
Toshiomi Yamazaki
Takuya Kuno
Reinhard Einsel